Proven Reliability and Domestic Stability:
With over 40 years of excellence since its founding in 1984, VLSIP is an independent, privately-owned company located exclusively in the United States with no history of legal entanglements.
Founded in 1984 in Richardson, Texas, our company has grown from a specialized local operation into a trusted, privately owned provider of advanced semiconductor services.
For more than four decades, we have operated exclusively within the United States, maintaining a strong reputation for integrity, reliability, and operational excellence.
Since our inception, we have never been involved in lawsuits or legal disputes of any kind—an achievement that underscores our longstanding commitment to ethical business practices and disciplined corporate governance.
VLSIP’s MISSION is design, assembly, and electrical test of circuits and subsystems for semiconductor manufacturers and OEMs with a focus on long-term strategic partnerships within the Medical, Government/ITAR, and high-reliability Commercial markets.
Our vision is to be the leading service provider of microchip interconnection technology. We operate as a trusted partner to Wafer Fabs and Systems Manufacturers, providing advanced semiconductor solutions critical to the research, development, and market introduction of the newest semiconductors.
VLSIP delivers advanced semiconductor packaging and electronic assembly solutions for companies that demand performance, reliability, and speed to market. With more than 40 years of engineering excellence, we partner with customers to solve complex interconnection challenges—from early design and rapid prototyping to high-volume production and qualification testing. As a trusted OSAT partner, we help you reduce risk, control costs, and accelerate product launches.
ISO-certified and ITAR-registered, VLSIP meets the highest standards for quality, security, and compliance. Our advanced capabilities—including 3D packaging and System-in-Package (SiP) technologies—enable smaller form factors, higher performance, and greater reliability.
Partner with VLSIP to bring your next project to life.
VLSIP delivers advanced semiconductor packaging and electronic assembly solutions for companies that demand performance, reliability, and speed to market. With more than 40 years of engineering excellence, we partner with customers to solve complex interconnection challenges—from early design and rapid prototyping to high-volume production and qualification testing. As a trusted OSAT partner, we help you reduce risk, control costs, and accelerate product launches.
ISO-certified and ITAR-registered, VLSIP meets the highest standards for quality, security, and compliance. Our advanced capabilities—including 3D packaging and System-in-Package (SiP) technologies—enable smaller form factors, higher performance, and greater reliability.
Partner with VLSIP to bring your next project to life.
1
2
3
4
5
6
Advanced circuit design, interconnect solutions from wafer to system-level assembly, and electrical test services.
Advanced assembly solutions - flip chip, BGA, QFN, stacked die, SMT/CCA, Multi-Chip Modules (MCM) and much more.
Conceptual drawings and schematics, advanced circuit and frequency simulation while integrating DFM to transition projects.
