VLSIP Technologies: Engineering Foundry for Electronics ®

40+

Years of Excellence

Advanced Semiconductor Packaging since 1984

VLSIP Technologies: Engineering Foundry for Electronics ®

VLSIP delivers advanced semiconductor packaging and electronic assembly solutions for companies that demand performance, reliability, and speed to market. With more than 40 years of engineering excellence, we partner with customers to solve complex interconnection challenges—from early design and rapid prototyping to high-volume production and qualification testing. As a trusted OSAT partner, we help you reduce risk, control costs, and accelerate product launches.

  • ISO 9001:2015 Certified
  • ITAR Registered
  • OSAT Contract Manufacturer
  • ISO 13485:2016 Certified
  • Responsible Business Alliance
  • Located only in the United States
WHAT WE DO

Markets Served

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Medical

Leading Tier 1 provider of implantable medical and medical equipment semiconductor solutions.

  • ISO 13485:2016
  • FDA 3 Compliant
  • Development | Prototypes | Production
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Government

Trusted local and federal government semiconductor solutions provider supplier since 1989

  • ISO 9001:2015
  • ExoStar and CMMC
  • Development | Prototypes | Production
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Commercial

Technology leader in advanced packaging for commercial and IoT electronic solutions across diverse global markets.

  • ISO 9001:2015
  • Automotive AEC-Q100
  • Development | Prototypes | Production
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Prototypes

Innovative leader in quick-turn semiconductor prototyping since 1984, serving complex, high-reliability applications worldwide.

  • Quick-turn prototyping
  • Advanced semiconductor R&D
  • Low, Mid, or High Volume Assembly
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Advanced Packaging Solutions

Technical Capabilities

Advanced Packaging Experts

VLSIP Technologies supports the entire lifecycle of advanced semiconductors, serving as an independent US-based engineering foundry that bridges the gap between initial research and high-volume production. We act as a trusted partner to Wafer Fabs and systems manufacturers, providing quick-turn prototypes essential for the development of the newest semiconductors, with specialized experience in diverse materials such as SiGe, GaAs, and GaN.

Our transition to production assembly is supported by a full array of advanced interconnect solutions, including flip chip, 3D packaging, and System-in-Package (SiP) technologies performed in controlled environments.

From Prototype to Production

To ensure market readiness, VLSIP offers full turnkey test solutions, designing custom software and hardware for parametric evaluation, alongside a rigorous qualification suite that utilizes failure analysis tools like scanning acoustic microscopy (CSAM), CT scans, and 2D X-Ray.

This end-to-end support is underpinned by a ubiquitous quality strategy and a tightly managed global supply chain, allowing for the seamless commercialization of complex electronic modules.

OUR TEAM

Our Leadership Team

Kristin Watson
Project Manager
Annette Black
Senior QA Engineer
Ralph Edwards
Engineer
Testimonials

Our Client Feedback

Kathryn Murphy

Engineering

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Kathryn Murphy

Engineering

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Kathryn Murphy

Engineering

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Let's discuss your project

972-437-5506 x178
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