40+
Years of Excellence
From design and prototyping to high-volume production, VLSIP delivers reliable solutions for the semiconductor industry.
From design and prototyping to high-volume production, VLSIP delivers reliable solutions for the semiconductor industry.
Years of Excellence
VLSIP delivers advanced semiconductor packaging and electronic assembly solutions for companies that demand performance, reliability, and speed to market. With more than 40 years of engineering excellence, we partner with customers to solve complex interconnection challenges—from early design and rapid prototyping to high-volume production and qualification testing. As a trusted OSAT partner, we help you reduce risk, control costs, and accelerate product launches.
Leading Tier 1 provider of implantable medical and medical equipment semiconductor solutions.
Trusted local and federal government semiconductor solutions provider supplier since 1989
Technology leader in advanced packaging for commercial and IoT electronic solutions across diverse global markets.
Innovative leader in quick-turn semiconductor prototyping since 1984, serving complex, high-reliability applications worldwide.
VLSIP Technologies supports the entire lifecycle of advanced semiconductors, serving as an independent US-based engineering foundry that bridges the gap between initial research and high-volume production. We act as a trusted partner to Wafer Fabs and systems manufacturers, providing quick-turn prototypes essential for the development of the newest semiconductors, with specialized experience in diverse materials such as SiGe, GaAs, and GaN.
Our transition to production assembly is supported by a full array of advanced interconnect solutions, including flip chip, 3D packaging, and System-in-Package (SiP) technologies performed in controlled environments.
To ensure market readiness, VLSIP offers full turnkey test solutions, designing custom software and hardware for parametric evaluation, alongside a rigorous qualification suite that utilizes failure analysis tools like scanning acoustic microscopy (CSAM), CT scans, and 2D X-Ray.
This end-to-end support is underpinned by a ubiquitous quality strategy and a tightly managed global supply chain, allowing for the seamless commercialization of complex electronic modules.
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