At VLSIP Technologies, we operate as an Engineering Foundry for Electronics®, offering comprehensive engineering services that span from initial concept through circuit and test design. Our expertise includes the design and optimization of advanced electronics through schematics, layouts, modeling, and frequency simulation, as well as thermal imaging and characterization. We provide specialized PCB design for various substrates like FR4, Flex, and lead frames, and we utilize 3D printed model concepts to support our rigorous Design for Manufacturability (DFM) approach. By collaborating closely with our partners through detailed SOW reviews and engineering design reviews, we ensure a full turnkey system design that meets the most challenging interconnection needs.
Beyond initial design, VLSIP Technologies provides robust Failure Analysis (FA) and reliability services to assist with product improvement strategies and qualification. We offer hardware and software troubleshooting support backed by advanced diagnostic tools, including 2D X-ray and CT scans, Scanning Acoustic Microscopy (SAM/CSAM), and detailed cross-sectioning. Our comprehensive reliability testing capabilities include temperature cycling, moisture soak testing, biased HAST, and burn-in / HTOL to ensure your products meet stringent industry standards such as JEDEC and MIL-STD. By integrating these FA services with physical testing—such as die shear, ball shear, and wire pulls—we deliver high-quality, breakthrough solutions that guarantee long-term performance for critical applications.
VLSIP can test or coordinate the completion of product qualification tests. Hardware and software troubleshooting support available to assist with product improvement strategies or Failure Analysis (FA).
Some of our Reliability and Qualification services include:
