At VLSIP Technologies, we specialize in providing breakthrough advanced technical solutions for high-performance applications, including high-power electro-optics IC and transistor driver assemblies and top emission electro-optics arrays. Our technical capabilities allow us to perform high-density I/O electro-optics mounting and wire bonding with extreme precision, achieving placement accuracies of ± 3µm and bond lines within ± 0.0003”. These sophisticated processes are performed in controlled environments to ensure the highest reliability for the most challenging interconnection needs.
We continuously advance the technology curve at VLSIP Technologies through complex 3D packaging solutions, such as SiP die stacking and wire bonding on ceramic substrates as thin as 25µm. Our expertise extends to Package on Package (PoP), flip chip, and stacked die configurations across a wide variety of wafer materials, including Si, SiGe, GaAs, GaN, and InP. By integrating these advanced interconnect technologies with custom test solutions and 3D laser AOI, we deliver innovative, high-quality results from the wafer level to complete system-level assembly.
Inspection & Measurements
We maintain rigorous standards through advanced cleaning processes like aqueous deflux and ultrasonic DI water systems, as well as marking solutions such as laser ink die marking and 2D barcode labels for full traceability.
