At VLSIP Technologies, we leverage our extensive process experience to provide high-precision assembly solutions, including mechanical sawing for 6”, 8”, and 12” wafers and automated die sorting for materials as thin as 4 mils.
Mechanical Sawing
6”, 8”, 12” Wafers
Min. 4 mils thick
Auto Die Sorting
Storage and Handling
PCBA Sawing
Laser Cutting
Custom Cutting
Custom Tooling
PCBA De-panel
Mechanical Sawing
6”, 8”, 12” Wafers
Min. 4 mils thick
Auto Die Sorting
Storage and Handling
Surface Mount & Die Attach
Our die attach capabilities offer exceptional accuracy, achieving ± 3µm with bond lines within ± 0.0003” for eutectic attachments, alongside epoxy and solder attach options with in-line reflow.
High Accuracy Placement
Epoxy & Solder Attach
Expandable Capacity
In-line Reflow
Component Value Verification
± 3µm Accuracy
± 0.0003” Bond Line
Eutectic Die Attach
DAF Application
Automatic Placement
Wire Bonding
We further support complex interconnect needs through a variety of bonding techniques, such as ball, wedge, ribbon, and security bonding.
Ball Bonding
Wedge bonding
Ribbon Bonding
SoS/ Security Bond
Chain Bonding
Encapsulation
To protect and complete your electronic modules, VLSIP Technologies offers diverse packaging and encapsulation solutions, including transfer molding, underfill, dam and fill, glob top, and lidding.
Transfer Mold
Glob Top
Dam and Fill
Lidding
Marking & Washing
We maintain rigorous standards through advanced cleaning processes like aqueous deflux and ultrasonic DI water systems, as well as marking solutions such as laser ink die marking and 2D barcode labels for full traceability.
Laser
Ink
2D Barcode Matrix
Die Marking
Labels
Batch Aqueous Deflux
Inline DI cleaner
Ultra Sonic
Wafer Rinse +CO2
In-house DI Water System
Ball Attach
At VLSIP Technologies, we provide high-precision ball attach process solutions that support Micro BGA applications with minimum ball sizes of 0.25 mm and a minimum pitch of 0.5 mm. To ensure the highest level of quality for these interconnects, our process includes 100% automated inspection, ball measurements, and physical testing such as ball shear.
Min. 0.25 mm Balls
Min. 0.5mm Pitch
Ball Measurements
Micro BGA Capable
100% Auto Inspect
Inspection & Measurements
We maintain rigorous standards through advanced cleaning processes like aqueous deflux and ultrasonic DI water systems, as well as marking solutions such as laser ink die marking and 2D barcode labels for full traceability.
