VLSIP Technologies has been a leader in innovation for prototyping since 1984, serving as a trusted partner to wafer fabs and systems manufacturers. We specialize in providing advanced interconnection quick-turn prototypes that are critical to the research and development of the newest semiconductors.
This prototyping capability is a core component of our full turnkey engagement model, which guides a project from the initial concept and 3D printed model concepts through to functional prototypes and final production assembly.
VLSIP’s prototyping business offers a wide range of custom assembly solutions, including back grinding, dicing, die attach, and complex wire bonding. VLSIP is equipped to handle various packaging formats such as ceramics, CDIP, QFP, and QFN, as well as specialized services like BGA rework and “scoop and goop”.
To support these development efforts, we provide full BOM procurement and ensure that prototypes can meet stringent industry standards, including JEDEC, MIL-STD, and AEC-Q100.
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