ISP9001_2015ISO13485_2016

Assisting Customers To Succeed 
In Their Marketplace

Semiconductor Back End

We routinely combine conventional Surface Mount printed circuit board assembly technologies with state-of-the-art Ball Grid Array, Flip Chip, Stacked Chip, Chip Scale, and Direct Chip semiconductor assembly technologies. We support, as a leading-edge technology company, engineering, prototype, low and higher volume assembly.
Dicing:
VLSIP receives and dices silicon slices in wafer format after probe, with diameters up to and including 12”.

Packaging Technology

Connections

Connections

Packages

Comments

Outside
Inside
SOT23/SO/……./TSSOP
TQFP
PowerPad (L/T/V QFP)
PowerPad (TQFP, VQFP)
Enhanced BGA
48-208 pins
32-208 pin
Up to 207 pins
256-1028 pins
Leads
Wire
(Semi-Rigid, Heat Sink)
Multi-chip, Rigid Substrate
(Ceramic, Metal)
Semi-Rigid Substrates (PCB)
Tape Based
Embedded Components
System in Package
Balls
Bond
Chip Scale, Semi-Rigid Substrates
Tape (10-19mm, 1.0mm thick)
Tape (4.5-19mm, 0.8mm thick)
Quad Flat No Lead (3-8mm)
Flip Chip, Rigid Substrates
Up to 255 pins
300+ pins
Up to 168 pins – 300+pins
14-56 pins
Bumps
Bumps
Semi-Rigid Substrates
Tape Based
Scheduling of Quick Turn Assembly

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VLSIP Technologies will provide a firm commitment to a requested turn time and ship date after receiving your completed work request.
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