Flip-Chip Die: to 2200 bump I/O’s, .2mm Bump Pitch.
SMT attach: High-speed placement to 10uM accuracy, 0201 feeders.
Encapsulation: Overmold systems with FAME assist, Liquid Encapsulation
Ball Attach Capability: Ceramic or laminate, 0.5mm pad pitch (0.25mm balls)
Singulation: Laminate, Ceramic singulation saw machines; Flex-tape presses.
Marking: Laser-etched plate epoxy transfer marking systems, laser marking, 2D barcode, small print labels.