Prototype Assembly

VLSIP Materials and Process Range for Prototypes & Modules:

Substrates/packages: Thin and Thick film LTCC (Ceramic), M.A.P. Laminate (FR-4, BT, Rogers), Flex-Tape (50 - 75uM thick), Alumina Tubs

Wafer Processes: Saw and Die Pick of wafers up to 300mm (12in) in size.

Die Processes: Wire-bondable, Flip-Chip, Die-to-Die bonding, Stacked-Die.

Wire Bonding: Ball or Wedge bonding, 0.7mil - 10mil wires, 45uM stagger or serial fine pad pitch, die pad openings as small as 45uM.

Flip-Chip Die: to 2200 bump I/O’s, .2mm Bump Pitch.

SMT attach: High-speed placement to 10uM accuracy, 0201 feeders.

Encapsulation: Overmold systems with FAME assist, Liquid Encapsulation

Ball Attach Capability: Ceramic or laminate, 0.5mm pad pitch (0.25mm balls)

Singulation: Laminate, Ceramic singulation saw machines; Flex-tape presses.

Marking: Laser-etched plate epoxy transfer marking systems, laser marking, 2D barcode, small print labels.