VLSIP’s Interconnect Technology Roadmap, driven by power (lower), size (smaller) and performance (better) has kept pace with and continues to track advances in semiconductor and microchip complexity.

LSIP has the interconnect technologies required for today’s products and tomorrow’s designs.

Increased chip complexity is enabling convergence not only of several devices in one but of more functions into the same or similar device creating new products and new markets. VLSIP is there with the interconnect technologies required to support both, and the 3D modeling and simulation to comprehend the impact of parasitics to module design and performance prior to fabrication.