VLSIP's Core Competencies Create Manufacturing Solutions


Leading Edge Strategy (Interconnection)
Chip to chip and chip to chip to package
Chip to multilayer printed circuit boards directly
Chips embedded into modules
Chip to package and to substrates including flexible substrates with external I/Os.
Surface Mount Technology ( 0101 packaged parts)
Ball Grid Array (.25mm ball size, .4mm pitch and ball counts from 4 to 1152)
Chip to package with external I/Os
Flip Chip (3 mil ball size, 8 mil pitch)
Stacked Chip, Chip Scale, and Direct Chip Attach
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