Volume Production

State-Of-The-Art Manufacturing Facilities & Equipment

A High-Volume Manufacturing Transition Process

Customer Strategic Manufacturing

Select High Volume Mfg. Site
Select Critical Mfg. Processes: For “Same As” Assy. Process

Surface Mount Technology

Ball Grid Array

Thin Ball Grid Array

Direct Chip Attach

Flip Chip, wire bond

Chip - to - Chip Bond

System in a single package

PCB’s, flexible tape, ceramics

Overmold System Requirements

Marking Requirements
Perform Process Gap Analysis
Identify VLSIP Equipment Set
Outline White Paper Process DOE’s
Document Mfg. Data Pack Content (Product Quality Plan)

Module Production and
Quality Plan

Set Product Specifications
Define Q.A. S.P.C. Parameters
DOE’s Input to Mfg. Data Pack Equipment Configuration Input
NRE Tooling/ Programming Input
Tool Design/Drawings Input
Resolve Proprietary Issues
Materials Preparation Input
Assembly Traveler Input
Set Production Schedule
Set M.D.P. Review Schedule

(with Customer)
Schedule 1st Article Review

(with Customer)
Set Cont. Process Imp. Plan

Transition to High Volume
Mfg. Plant

Manufacturing Data Pack - (review with Customer)

Incremental Assy. Samples - (define with Customer)

VLSIP Drawings pack
Process Eng. Access - (By Customer or H-VM)

Validate H-VM 1st Article
H-VM Consultation

State-Of-The-Art Manufacturing Facilities & Equipment