Materials and Process Range for Prototypes & Modules:
Substrates/packages: Thin and Thick film LTCC (Ceramic),
M.A.P. Laminate (FR-4, BT, Rogers), Flex-Tape (50 - 75uM thick),
Wafer Processes: Saw and Die Pick of wafers up to 300mm
(12in) in size.
Die Processes: Wire-bondable, Flip-Chip, Die-to-Die
Wire Bonding: Ball or Wedge bonding, 0.7mil - 10mil
wires, 45uM stagger or serial fine pad pitch, die pad openings as small
Flip-Chip Die: to 2200 bump I/O’s, .2mm Bump Pitch.
SMT attach: High-speed placement to 10uM accuracy, 0201
systems with FAME assist, Liquid Encapsulation
Ball Attach Capability: Ceramic or laminate, 0.5mm pad
pitch (0.25mm balls)
Singulation: Laminate, Ceramic singulation saw machines;
Marking: Laser-etched plate epoxy transfer marking