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PROTOTYPE ASSEMBLY

 

VLSIP Materials and Process Range for Prototypes & Modules:

*     Substrates/packages: Thin and Thick film LTCC (Ceramic), M.A.P. Laminate (FR-4, BT, Rogers), Flex-Tape (50 - 75uM thick), Alumina Tubs

*     Wafer Processes: Saw and Die Pick of wafers up to 300mm (12in) in size.

*     Die Processes: Wire-bondable, Flip-Chip, Die-to-Die bonding, Stacked-Die.

*     Wire Bonding: Ball or Wedge bonding, 0.7mil - 10mil wires, 45uM stagger or serial fine pad pitch, die pad openings as small as 45uM.

*     Flip-Chip Die: to 2200 bump I/Os, .2mm Bump Pitch.

*     SMT attach: High-speed placement to 10uM accuracy,  0201 feeders.

*     Encapsulation: Overmold systems with FAME assist, Liquid Encapsulation

*     Ball Attach Capability: Ceramic or laminate, 0.5mm pad pitch (0.25mm balls)

*     Singulation: Laminate, Ceramic singulation saw machines; Flex-tape presses.

*     Marking: Laser-etched plate epoxy transfer marking systems.

 

 

Copyright 2007 VLSIP Technologies, Inc | All Rights Reserved | 120-50-150 Rev. B.

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