VLSIP has the interconnect
technologies required for today’s products and tomorrow’s designs.
VLSIP’s Interconnect Technology Roadmap, driven by power (lower), size (smaller)
and performance (better) has kept pace with and continues to track
advances in semiconductor and microchip complexity.
Increased chip complexity is enabling convergence not only of several
devices in one but of more functions into the same or similar device
creating new products and new markets. VLSIP is there with the
interconnect technologies required to support both, and the 3D modeling
and simulation to comprehend the impact of parasitics
to module design and performance prior to fabrication.