VLSIP's Core Competencies Create Manufacturing Solutions




Leading Edge Strategy  (Interconnection)

*       chip to chip and chip to chip to package

*       chip to multilayer printed circuit boards directly

*       chips embedded into modules

*       chip to package and to substrates including flexible substrates with external I/Os.

*       Surface Mount Technology  ( 0101 packaged  parts)

*       Ball Grid Array (.25mm ball size, .4mm pitch and ball counts from 4 to 1152)

*       chip to package with external I/Os

*        Flip Chip (3 mil ball size, 8 mil pitch)

*       Stacked Chip, Chip Scale, and Direct Chip Attach

*       Mixed technology substrates, tapes, rigid flex and flex as well as rigid printed circuit boards.

Subsystem Microchip Modules for Military, Space & Homeland Security. Industrial & Communication Applications



Copyright 2007 VLSIP Technologies, Inc | All Rights Reserved | 120-50-150 Rev. H

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