Leading Edge Strategy (Interconnection)
chip to chip and chip to chip to package
chip to multilayer printed circuit boards directly
chips embedded into modules
chip to package and to substrates including flexible
substrates with external I/Os.
Surface Mount Technology ( 0101 packaged
Ball Grid Array (.25mm ball size, .4mm pitch
and ball counts from 4 to 1152)
chip to package with external I/Os
Flip Chip (3 mil ball size, 8 mil pitch)
Stacked Chip, Chip Scale, and Direct Chip Attach
Mixed technology substrates, tapes, rigid flex and flex
as well as rigid printed circuit boards.
Subsystem Microchip Modules
for Military, Space & Homeland Security. Industrial &