Emerging businesses find
advantage when out-sourcing with VLSIP Technologies.
Services are customized to meet time-to-market challenges and reduce
total cost of ownership.
design and redesign concepts can be pursued and implemented with
selections are optimized by VLSIP quality-to-cost design focus for best
Authorized Vendor List management by VLSIP can minimize start-up costs.
are effectively resolved with VLSIP manufacturing core competencies.
equipment investment and risk can be minimized.
Plan data collection is reviewed by VLSIP for agreement on Pareto and
cost-reduction focus items.
support requirements are met by VLSIPís experienced staff.
Stacked Die Wire Bond
Chip to Chip Wire Bond
Emerging Businesses are
fully supported with technical competence and with responsive
Technology Roadmap is driven by chip complexity, substrate interface,
evolving industry technologies and interconnection manufacturing.
is continues to invest in state-of-the-art manufacturing equipment and
processes, to provide system designers the manufacturing infrastructure
to support new designs and products.
is committed to work closely with the Customer Product Team to meet
customer requirements, including time-to-market and target costs.
protects proprietary information by maintaining confidentiality
of products, processes and technology, including, as required,
restricted access to production areas & documentation. VLSIP has
never had a violation since inception.