Complete Solutions Focused on Leading Edge Interconnect Technology

PARTNER LINKS

Customer Login

 

DESIGN & LAYOUT

 

VLSIP TECHNOLOGIES offer mixed signal (analog, digital, and RF) Chips-to-System Technology with a focus on Medical Devices’, Convergence of Functions, and Miniaturization.

*     Design Project Management

*     Turnkey Design Solutions

*     Substrate Circuit Design

o   Wire Bond

o   COB

o   SMT and TH Multilayer

o   Signal Integrity

o   Industry’s Leading Design Tools

*     Packaging Design

o   BGA, uBGA, Flip Chip

o   Device packaging

o   Enclosures

o   Platforms

*     Design for Test (DFT)

*     Design for Manufacturing (DFM)

*     ISO 9001, and ISO 13485 Certified

*     Primarily Design Tool Set: Mentor Graphics PADS, AutoCad, and 3D Solidworks

*     3D EM Modeling & Simulation

Product Engagements Including: Medical OEM Applications, Cardiac Rhythm Management Neurostimulation, Drug Pumps, Sensors, Wound Therapy, and Pain Management.

 

 

Copyright 2007 VLSIP Technologies, Inc | All Rights Reserved | 120-50-150 Rev. B.

Home | About Us | Quality | Req Form | Contact Us