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OUR SERVICES
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MARKETS
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PARTNER
LINKS
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COMMUNICATIONS, WIRELESS, NETWORKING
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VLSIP is a leading supplier of mixed
signal semiconductor / electronic modules for wireless, wire line,
microwave, and fiber optic communications applications for engineering
prototype as well as low and higher volume assembly.
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Advanced
design with
11 unpackaged silicon & GaAs chips on board plus more than a
dozen additional packaged components.
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VLSIP’s integrated, design, layout,
engineering and manufacturing processes combine state-of-the-art
semiconductor (mixed signal, including RF) packaging and process
control techniques and leading edge wire bond assembly technology with
conventional surface mount board assembly technologies. We assemble
both packaged and unpackaged microchips into modules mounted on rigid
or flex substrates, and deliver the complex high reliability integrated
solutions demanded by our customer’s.
3D EM Modeling and Simulation to
comprehend impact of parasitic to module design and performance prior
to fabrication.
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200 MHz
device with 12 layers, 6 unpackaged silicon & GaAs chips on
board plus dozens of packaged components
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